Product Overview
BL-M8852BS2 valde integrata duplicata banda wireless moduli coniungens Wi-Fi 6 802.11ax et Bluetooth 5.2 in solutione unica pacti est. Powered by Realtek RTL8852BS-CG chipset, 2.4GHz & 5GHz nexus concurrentes sustinet cum data rate usque ad 1200Mbps, stabilis, alta velocitas wireless connectivity tradens ad machinas mundi infixas.
Clavis Commoda
Verum WiFi VI Volo
1200Mbps cohortis dualis 2T2R, OFDMA & MU-MIMO sustinet pro 4K fluentibus et multi- formis nexuum levibus.
Bluetooth 5.2 Dual-Modo
Simultaneum LE + BR/EDR operationis specimen remotis, audio, et connectivity sensoriis.
Ultra-Foedus Design
15.1×13.1×2.1mm factoris formae, aptae machinis gracilibus et spatiis constrictis facile.
Industriae Stabilitas
-20°C ad +70°C range operantem, ESD praesidium, et massa productio consistens in qualitate.
Scopum Applications
OTT / IPTV Set-Top Boxes
HD IP Cameras
Smart Home Gateways
Industrial HMI & Tabulettae
Smart Orator & Displays
Cur elige BL-M8852BS2?
- ✅ Omnes in unum WiFi 6 + BT 5.2 combo consilium reducit BOM cost
- Stabilis perficientur & alta cede pro massa productio
- Standard SDIO 3.0 + UART interfaces ad facilem integrationem
- ✅ Global certificatione subsidium (FCC, CE) pro celeriter forum launch
- Professio technica sustentatio & stabilis diu-term copia
Obstructionum Diagram
Product Dimension
Module dimensio: 15.1*13.1*2.1mm(L*W*H; Tolerantia: ±0.15mm)
Sarcina Dimensiones
Specificatio sarcina:
1. 1,000 modulorum per roll et 5,000 modulorum in arca.
2. Arca exterioris magnitudinis: 37.5*36*29cm.
3. Diameter caerulei ambitus amicae Flexilis laminae est 13 digitorum, cum tota 28mm crassitudine (cum latitudine 24mm cinguli gestantis).
4. Pone 1 sarcinam agentis aridae (20g) et humiditatis chartae in singulis sacculi anti-staticis vacuo.
5. Quisque lobortis cum 5 scriniis refertum est.
Specificationes generales
| OMNIBUS Nomen |
BL-M8852BS2 |
| Chipset |
RTL8852BS-CG |
| WLAN Signa |
IEEE 802.11a/b/g/n/ac/ax (WiFi 6) |
| Hospes Interface |
SDIO pro WLAN & UART ad BT |
| Antenna |
Antennas externas per medium foramen coniungere |
| Dimension |
15.1*13.1*2.10mm (L*W*H) |
| Potestas Supple |
VDD33=3.3V±0.2V@1100 mA (Max)
VDDIO=3.3V±0.2V / 1.8V±0.1V |
| Operatio Temperature |
-20℃ ad +70℃ |
| operatio Umor |
X% ad XCV% RH (Non-Condensing) |
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