In domo / Productus / Wi-fi moduli / Wi-fi VI moduli / M8800mc1 1T1r 802.11b / G / N / Ax WiFi + B5.2 OMNIBUS

loading

Share est:
Facebook Sharing Button
Twitter Socius Button
Line sharing button
Weckat Sharing Button
LinkedIn Sharing Button
Pinterest Sharing Button
Whatsapp Sharing Button
Sharing Sharing Button

M8800mc1 1T1r 802.11b / G / N / Ax WiFi + B5.2 OMNIBUS

  • Aic8800mc
  • USB et SDIO + uart
  • 2.4GHz
  • 286.8mbps
  • 1x1 1T1r
  • XII * XII * 2.1mm
Availability:
Quantitas:
  • BL, M8800mc1

  • Lb_link

  • V5.2

  • AIC

  • 1t1r

  • Usb2.0 interface

Introductio

BL-m8800mc1 est altus integrated IT Module quod miscere cum Wlan Subsystem, Bluetooth Subsystem, MCU Subsystem, Memoria Subsystem, PMU periphericis interfaces. Et features of parva magnitudine, multi-munera, princeps perficientur, humilis potestate consummatio sunt specimen for flexibile applications de Internet de rebus fundatur in WLAN et B communication.


Features

• 240MHz Cortex-M4F CPU (cum MPU & FPU)

• 608kb SRAM, 704KB ROM, 16MB mico

• GPIO, multiplexed peripherals, SDIO / Spi / USB / UART / I2S / I2C / PWM / ADC

• RF range: 2.4 ~ 2.4835GHz

• Wi-fi 802.11b / G / N / AX (XX / 40MHz, 1T1R, usque ad 286.8MBPS Phy Rate)

• Integrated PMU: tantum requirit 3.3v Main + 1.8v / 3.3vi / O potentia


Obstructionum Diagram

截屏 2025-04-28 15.05.15


Generalis specifications

OMNIBUS

BL, M8800mc1

Chipset

Aic8800mc

WLAN signa

Ieee802.11b / g / n / securi

Bt specificationem

Bluetooth Core Specification V5.2 / V4.2 / v2.1

HOST Interface

USB ad WLAN + B vel SDIO ad WLAN & UART in B

Antenna

Iungo ad externum Antenas per medium foraminis codex

Dimensio

12.0 * 12.0 * 2.1mm

POPULUM

3.3v ± 0.2v Main Power copia @ 600MA (Max)

3.3v ± 0.2V aut 1.8v ± 0.1vi / O potentia copia

Operatio temperatus

-20 ℃ ad + LXX ℃

Operatio Umor

X% ad XCV% RH (non-condensing)


Productum dimensionem

截屏 2025-04-28 15.08.07

Module DIMENSION: 12.0 * 12.0 * 2.1MM (L * W * H; tolerantia, ± 0.3mm_l / w, ± 0.2mm_h)


Sarcina dimensiones

图片 I

图片 II

Package Specification:

I. 1,000 modulorum per volumine et 5,000 modules per arca.

II. Puteus Size: 37,5 * * 29cm 37.5.

III. Diametrum ex hyacintho amet-amica Flexilis laminam est XIII pollices, cum totalis crassitudine 28mm (cum latitudinem 24mm portantes balteum).

IV. Pone I sarcina ex arida agente (20g) et I humiditas card in se anti-stabilis vacuo peram.

V. Quisque lobortis est cum V boxes.






Previous: 
Next: 

Related Products

Related Articles

Content vacat!

Guangming District, Shenzhen, ut a investigationis et progressionem et foro ministerium basis et instructum magis quam 10,000m² automated productio official et logistics warehousing centers.

Quick Links

Relinquere nuntium
Contact Us

Uber genus

Contact Us

   + 86- 13923714138
  LXXXVI 13923714138
   Business Email: sales@lb-link.com
   Technical Support: info@lb-link.com
   querimonia Email: querela@lb-link.com
   Shenzhen headquarter: 10-11 / F, A1 A1, Huaqiang ideam Park, Guangenang RD, Guangming New District, Shenzhen, Guangdong, Sina.
 Shenzhen Factory: 5f, Aedificiumium C, No.32 Dafu Rd, Longhua District, Shenzhen, Guangdong, Sinis.
Jiangxi Factory: LB-Link Industrial Park, Qingua RD, Ganzhou, Jiangxi, Sinis.
Copyright © 2024 Shenzhen Bilian Electronic Co., Ltd. All Rights Reserved. Squama Sitemap | Privacy Policy