| Availability: | |
|---|---|
| Quantitas: | |
BL, M8800DS5-l
Lb-link
V5.2
AIC
1t1r
SDIO Interface
Introductio
BL-M8800DS5-L est valde integrata WLAN + B Combo basi moduli in AIC8800DL chip, quae componit subsystem subsystem et 1T1R WLAN B v5.2 subsystem. Huius moduli compatibilis IEEE 802.11b/g/n/ax vexillum praebet ac maximum PHY rate usque ad 287Mbps, offerens plumam-dives iunctivam, ad distantiam et alta signa tradens.
Features
Frequentia operans: 2.4~2.4835GHz
Wireless PHY rate pervenire potest ad 287Mbps cum 20/40MHz Sed
Interfaces exercitum sunt SDIO vel USB 2.0 (Duae interfaces eodem tempore adhiberi non possunt)
Support STA, AP, WLAN Modi directi simul
Obstructionum Diagram

Generalis specifications
OMNIBUS |
BL, M8800DS5-l |
Chipset |
AIC8800DL |
WLAN Signa |
IEEE802.11b/g/n/ax |
B Specification |
B Core Specification v5.2 |
HOST Interface |
SDIO pro WLAN & UART pro B vel USB pro WLAN + B* |
Antenna |
|
Dimensio |
12.0* 12.0*1.7mm |
POPULUM |
3.3V summa potentia copia @ 600mA (Max) 3.3V vel 1.8VI/O potentia copia |
Operatio temperatus |
-20 ℃ ad + LXX ℃ |
Operatio Umor |
X% ad XCV% RH (non-condensing) |
Productum dimensionem

Modulus dimensio: 12.0*12.0*1.7mm (L*W*H; Tolerantia: ±0.3mm_L/W, ±0.2mm_H)
Sarcina dimensiones


Package Specification:
1. 2.000 modulorum per volumen et 10,000 modulorum per capsam.
II. Puteus Size: 37,5 * * 29cm 37.5.
III. Diametrum ex hyacintho amet-amica Flexilis laminam est XIII pollices, cum totalis crassitudine 28mm (cum latitudinem 24mm portantes balteum).
IV. Posuit I sarcina ex arida agente (20g) et humiditas card in se anti-stabilis vacuo peram.
V. Quisque lobortis est cum V boxes.
Introductio
BL-M8800DS5-L est valde integrata WLAN + B Combo basi moduli in AIC8800DL chip, quae componit subsystem subsystem et 1T1R WLAN B v5.2 subsystem. Huius moduli compatibilis IEEE 802.11b/g/n/ax vexillum praebet ac maximum PHY rate usque ad 287Mbps, offerens plumam-dives iunctivam, ad distantiam et alta signa tradens.
Features
Frequentia operans: 2.4~2.4835GHz
Wireless PHY rate pervenire potest ad 287Mbps cum 20/40MHz Sed
Interfaces exercitum sunt SDIO vel USB 2.0 (Duae interfaces eodem tempore adhiberi non possunt)
Support STA, AP, WLAN Modi directi simul
Obstructionum Diagram

Generalis specifications
OMNIBUS |
BL, M8800DS5-l |
Chipset |
AIC8800DL |
WLAN Signa |
IEEE802.11b/g/n/ax |
B Specification |
B Core Specification v5.2 |
HOST Interface |
SDIO pro WLAN & UART pro B vel USB pro WLAN + B* |
Antenna |
|
Dimensio |
12.0* 12.0*1.7mm |
POPULUM |
3.3V summa potentia copia @ 600mA (Max) 3.3V vel 1.8VI/O potentia copia |
Operatio temperatus |
-20 ℃ ad + LXX ℃ |
Operatio Umor |
X% ad XCV% RH (non-condensing) |
Productum dimensionem

Modulus dimensio: 12.0*12.0*1.7mm (L*W*H; Tolerantia: ±0.3mm_L/W, ±0.2mm_H)
Sarcina dimensiones


Package Specification:
1. 2.000 modulorum per volumen et 10,000 modulorum per capsam.
II. Puteus Size: 37,5 * * 29cm 37.5.
III. Diametrum ex hyacintho amet-amica Flexilis laminam est XIII pollices, cum totalis crassitudine 28mm (cum latitudinem 24mm portantes balteum).
IV. Posuit I sarcina ex arida agente (20g) et humiditas card in se anti-stabilis vacuo peram.
V. Quisque lobortis est cum V boxes.
WiFi VII: Reshapping futurum landscape of summus celeritate wireless connectivity
Wi-FI VII Decoded: Key Technologies et integration provocationes ad hardware designers
WiFi VI nobis WiFi VII: Quod est verum upgrade in domum network?
LB-Link USB WiFi nibh MMXXV in-profundum recensionem: euismod, valorem & buying Guide
Wi-FI VII Explained: 320MHz celeritate, Ultra-Low Lacticy & Global Applications Guide
Ex WiFi I ad WiFi VII: Decoding Quam LB-Link Reshapes in Home Networking Usus
Quid est WiFi VII? In MMXXV Guide to celeritate, Efficens & Real-World Applications