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BL-M7661LS1
Lb-link
V5.0
MTDIATEK
2T2R
Wi-Fi: SDIO BT: UART
Wi-fi V (802.11AC)
Velit 5G Wi-Fi Module cum Dual Band 2.4G/5.8G et High Power
BL-M7661LS1 valde integratur 2T2R 802.11a/b/g/n/ac Wireless LAN (WLAN) retis et moduli combo Bluetooth. Modulus instrumenti est SDIO1.1/2.0/3.0. Componit WLAN MAC, 2T2R capax WLAN basis cohortis. Bluetooth auxilio 5.0 effectus. Modulus BL-M7661LS1 plenam solutionem praebet pro magno throughput perficiendi WLAN et BT fabrica integrali.
Features
Frequentia operans: 2.4~2.4835GHz et 5.15~5.85 GHz
Hostia interface est SDIO3.0 (parere cum SDIO2.0)
IEEE Signa: IEEE 802.11a/b/g/n/ac
Support 20/40M band in 2.4G band and 20/40/80M bandwidth in 5G band
Wireless notitia rate potest pervenire ad 867Mbps
Supports Bluetooth v5.0 et Compatible Bluetooth v4.2
Antenna externa per medium foramen codex coniungere
Potestas Supple: 3.3V potestas principalis , 1.8or3.3V potestas copia I/O.
Obstructionum Diagram


Generalis specifications
OMNIBUS |
BL-M7661LS1 |
Chipset |
MT7661LSN |
WLAN Latin |
IEEE 802.11 a/b/g/n/ac |
BT Specification |
Bluetooth Core Specification v5.0/4.2 |
HOST Interface |
Hostia interface est SDIO3.0 (parere cum SDIO 2.0) |
Antenna |
Antennas externas per medium foramen caudex coniungere |
Dimensio |
13.10*15.10*2.6mm (L*W*H) |
POPULUM |
DC 3.3V±0.3V @ 1200 mA (Max) principalis potentia |
Operatio temperatus |
-20 ℃ ad + LXX ℃ |
Operatio Umor |
X% ad XCV% RH (non-condensing) |
Productum dimensionem

Module dimensio: 13.10*15.10*2.6mm(L*W*H; Tolerantia: ±0.15mm)


Package Specification:
1. 1000 modulorum per volumen et 5,000 modulorum in arca.
II. Puteus Size: 37,5 * * 29cm 37.5.
3. Diameter caerulei ambitus amicae Flexilis laminae est 13 digitorum, cum tota crassitudine 28mm
(cum latitudine 24mm balteum gerens).
4. Pone 1 sarcinam agentis aridae (20g) et humiditatis chartae in singulis sacculi anti-staticis vacuo.
5. Quisque lobortis referta V boxes
Velit 5G Wi-Fi Module cum Dual Band 2.4G/5.8G et High Power
BL-M7661LS1 valde integratur 2T2R 802.11a/b/g/n/ac Wireless LAN (WLAN) retis et moduli combo Bluetooth. Modulus instrumenti est SDIO1.1/2.0/3.0. Componit WLAN MAC, 2T2R capax WLAN basis cohortis. Bluetooth auxilio 5.0 effectus. Modulus BL-M7661LS1 plenam solutionem praebet pro magno throughput perficiendi WLAN et BT fabrica integrali.
Features
Frequentia operans: 2.4~2.4835GHz et 5.15~5.85 GHz
Hostia interface est SDIO3.0 (parere cum SDIO2.0)
IEEE Signa: IEEE 802.11a/b/g/n/ac
Support 20/40M band in 2.4G band and 20/40/80M bandwidth in 5G band
Wireless notitia rate potest pervenire ad 867Mbps
Supports Bluetooth v5.0 et Compatible Bluetooth v4.2
Antenna externa per medium foramen codex coniungere
Potestas Supple: 3.3V potestas principalis , 1.8or3.3V potestas copia I/O.
Obstructionum Diagram


Generalis specifications
OMNIBUS |
BL-M7661LS1 |
Chipset |
MT7661LSN |
WLAN Latin |
IEEE 802.11 a/b/g/n/ac |
BT Specification |
Bluetooth Core Specification v5.0/4.2 |
HOST Interface |
Hostia interface est SDIO3.0 (parere cum SDIO 2.0) |
Antenna |
Antennas externas per medium foramen caudex coniungere |
Dimensio |
13.10*15.10*2.6mm (L*W*H) |
POPULUM |
DC 3.3V±0.3V @ 1200 mA (Max) principalis potentia |
Operatio temperatus |
-20 ℃ ad + LXX ℃ |
Operatio Umor |
X% ad XCV% RH (non-condensing) |
Productum dimensionem

Module dimensio: 13.10*15.10*2.6mm(L*W*H; Tolerantia: ±0.15mm)


Package Specification:
1. 1000 modulorum per volumen et 5,000 modulorum in arca.
II. Puteus Size: 37,5 * * 29cm 37.5.
3. Diameter caerulei ambitus amicae Flexilis laminae est 13 digitorum, cum tota crassitudine 28mm
(cum latitudine 24mm balteum gerens).
4. Pone 1 sarcinam agentis aridae (20g) et humiditatis chartae in singulis sacculi anti-staticis vacuo.
5. Quisque lobortis referta V boxes
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