Velit 5G Wi-Fi Module cum Dual Band 2.4G/5.8G et High Power
Introductio
BL-M7661LS1 valde integratur 2T2R 802.11a/b/g/n/ac Wireless LAN (WLAN) retis et moduli combo Bluetooth. Modulus instrumenti est SDIO1.1/2.0/3.0. Componit WLAN MAC, 2T2R capax WLAN basis cohortis. Bluetooth auxilio 5.0 effectus. Modulus BL-M7661LS1 plenam solutionem praebet pro magno throughput perficiendi WLAN et BT fabrica integrali.
Features
Frequentia operans: 2.4~2.4835GHz et 5.15~5.85 GHz
Hostia interface est SDIO3.0 (parere cum SDIO2.0)
IEEE Signa: IEEE 802.11a/b/g/n/ac
Support 20/40M band in 2.4G band and 20/40/80M bandwidth in 5G band
Wireless notitia rate potest pervenire ad 867Mbps
Supports Bluetooth v5.0 et Compatible Bluetooth v4.2
Antenna externa per medium foramen codex coniungere
Potestas Supple: 3.3V potestas principalis , 1.8or3.3V potestas copia I/O.
Obstructionum Diagram
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Specificationes generales
OMNIBUS Nomen |
BL-M7661LS1 |
Chipset |
MT7661LSN |
WLAN Standard |
IEEE 802.11 a/b/g/n/ac |
BT Specification |
Bluetooth Core Specification v5.0/4.2 |
Hospes Interface |
Hostia interface est SDIO3.0 (parere cum SDIO 2.0) |
Antenna |
Antennas externas per medium foramen caudex coniungere |
Dimension |
13.10*15.10*2.6mm (L*W*H) |
Potestas Supple |
DC 3.3V±0.3V @ 1200 mA (Max) principalis potentia |
Operatio Temperature |
-20℃ ad +70℃ |
operatio Umor |
X% ad XCV% RH (Non-Condensing) |
Product Dimension
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Module dimensio: 13.10*15.10*2.6mm(L*W*H; Tolerantia: ±0.15mm)
Sarcina Dimensiones
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Specificatio sarcina:
1. 1000 modulorum per volumen et 5,000 modulorum in arca.
2. Arca exterioris magnitudinis: 37.5*36*29cm.
3. Diameter caerulei environment - amicae Flexilis laminae est 13 digitorum, cum tota crassitudine 28mm
(cum latitudine 24mm balteum gerens).
4. Pone 1 sarcinam agentis aridi (20g) et humiditatis schedulae in singulis sacculi anti-staticis vacui.
5. Quisque lobortis referta V boxes
