Maximum euismod Dual cohortem 2.4G Wi-FI moduli cum wireless connectivity for solaris inverter
Introductio
BL-m8192eu9 moduli est summus potentia WLAN moduli cum USB2.0 interface secundum realtek RTL8192eu-VP-CG Chipset. Hoc moduli compatible IEEE 802.11B / g / n vexillum et praebet maximum phy rate usque ad 300mbps. Hoc aedificavit-in altus-potentia fem significantly extend WLAN communicationis distantia, idealis pro diu-range wireless video transmissionem applications de IP cameras et uaVs.
Features
Operating Frequency: 2.4 ~ 2.4835GHz
Support IEEE 802.11N 2x2 Mimo cum XX / 40mhz Bandwidth et Max PHY rate usque ad 300mbps
Support WEP / WPA / WLAN2 WLAN securitatem
Support STA et mollis-AP Modus
Built-in summus potentia fem diu rhoncus tradenda
Una DC5V ± 0.25V potentia copia input
* XLV * XXXV 3.5mm LCC + LGA forma factor Package
Obstructionum Diagram
Generalis specifications
OMNIBUS | BL-m8192eu9 |
Chipset | RTL8192eu-VP, CG |
WLAN Latin | IEEE 802.11 B / G / N |
HOST Interface | USB 2.0 |
Antenna | Ipex / mhf-I iungo enim externa antenna |
Dimensio | * XLV * 3.5mm XXXV (L * w * h) |
POPULUM | DC 5.0v ± 0.5V @ 1800MA ( Pecco) |
Consummatio | <9W |
Coegi Support Platform | Linux: Support kernel 2.6.18 ~ 5.10 (XXXII & 64bit) |
Operatio temperatus | -20 ℃ ad + L ℃ |
Operatio Umor | X% ad XCV% RH (non-condensing) |
Productum dimensionem
Module DIMENSION: XLV * XXXV * 3.5mm (L * W * H; tolerantia, ± 0.15MM)
Ipex / MHF, I Connector dimensionem: 2.6 * 3.0 * 1.2mm (l * w * h, ø2.0mm)
Sarcina dimensiones
Package Specification:
I. XXIV Modules per Blister laminam et CCLXIV Modules per arca.
II. Et blister tenetur cum filum membrana et posuit in anti-stabilis vacuo peram.
III. Posuit I peram arida Baads (20g) et I PC humiditas card in se anti-stabilis vacuo peram.
IV. Et exteriori magnitudine est 35,2 * 21.5 * 15.5cm.
