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BL-M8800DS5-L
LB-LINK
V5.2
AIC
1T1R
SDIO Interface
Introductio
BL-M8800DS5-L est valde integrata WLAN + B Combo basi moduli in AIC8800DL chip, quae componit subsystem subsystem et 1T1R WLAN B v5.2 subsystem. Huius moduli compatibilis IEEE 802.11b/g/n/ax vexillum praebet ac maximum PHY rate usque ad 287Mbps, offerens plumam-dives iunctivam, ad distantiam et alta signa tradens.
Features
Frequentia operans: 2.4~2.4835GHz
Wireless PHY rate pervenire potest ad 287Mbps cum 20/40MHz Sed
Interfaces exercitum sunt SDIO vel USB 2.0 (Duae interfaces eodem tempore adhiberi non possunt)
Support STA, AP, WLAN Modi directi simul
Obstructionum Diagram

Specificationes generales
OMNIBUS Nomen |
BL-M8800DS5-L |
Chipset |
AIC8800DL |
WLAN Signa |
IEEE802.11b/g/n/ax |
B Specification |
B Core Specification v5.2 |
Hospes Interface |
SDIO pro WLAN & UART pro B vel USB pro WLAN + B* |
Antenna |
|
Dimension |
12.0* 12.0*1.7mm |
Potestas Supple |
3.3V summa potentia copia @ 600mA (Max) 3.3V vel 1.8VI/O potentia copia |
Operatio Temperature |
-20℃ ad +70℃ |
operatio Umor |
X% ad XCV% RH (Non-Condensing) |
Product Dimension

Modulus dimensio: 12.0*12.0*1.7mm (L*W*H; Tolerantia: ±0.3mm_L/W, ±0.2mm_H)
Sarcina Dimensiones


Specificatio sarcina:
1. 2.000 modulorum per volumen et 10,000 modulorum in arca.
2. Arca exterioris magnitudinis: 37.5*36*29cm.
3. Diameter caerulei ambientis-amici Flexilis laminae est 13 digitorum, cum tota crassitudine 28mm (cum latitudine 24mm cinguli gestantis).
4. Pone 1 sarcinam agentis aridi (20g) et humiditatis schedulae in singulis sacculi anti-staticis vacui.
5. Quisque lobortis cum 5 scriniis refertum est.
Introductio
BL-M8800DS5-L est valde integrata WLAN + B Combo basi moduli in AIC8800DL chip, quae componit subsystem subsystem et 1T1R WLAN B v5.2 subsystem. Huius moduli compatibilis IEEE 802.11b/g/n/ax vexillum praebet ac maximum PHY rate usque ad 287Mbps, offerens plumam-dives iunctivam, ad distantiam et alta signa tradens.
Features
Frequentia operans: 2.4~2.4835GHz
Wireless PHY rate pervenire potest ad 287Mbps cum 20/40MHz Sed
Interfaces exercitum sunt SDIO vel USB 2.0 (Duae interfaces eodem tempore adhiberi non possunt)
Support STA, AP, WLAN Modi directi simul
Obstructionum Diagram

Specificationes generales
OMNIBUS Nomen |
BL-M8800DS5-L |
Chipset |
AIC8800DL |
WLAN Signa |
IEEE802.11b/g/n/ax |
B Specification |
B Core Specification v5.2 |
Hospes Interface |
SDIO pro WLAN & UART pro B vel USB pro WLAN + B* |
Antenna |
|
Dimension |
12.0* 12.0*1.7mm |
Potestas Supple |
3.3V summa potentia copia @ 600mA (Max) 3.3V vel 1.8VI/O potentia copia |
Operatio Temperature |
-20℃ ad +70℃ |
operatio Umor |
X% ad XCV% RH (Non-Condensing) |
Product Dimension

Modulus dimensio: 12.0*12.0*1.7mm (L*W*H; Tolerantia: ±0.3mm_L/W, ±0.2mm_H)
Sarcina Dimensiones


Specificatio sarcina:
1. 2.000 modulorum per volumen et 10,000 modulorum in arca.
2. Arca exterioris magnitudinis: 37.5*36*29cm.
3. Diameter caerulei ambientis-amici Flexilis laminae est 13 digitorum, cum tota crassitudine 28mm (cum latitudine 24mm cinguli gestantis).
4. Pone 1 sarcinam agentis aridi (20g) et humiditatis schedulae in singulis sacculi anti-staticis vacui.
5. Quisque lobortis cum 5 scriniis refertum est.
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