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BL-M8852BS2
LB-LINK
V5.2
REALTEK
2T2R
Wi-Fi:SDIO BT:UART
Introductio
BL-M8852BS2 valde integrata est Dual-band WLAN + Bluetooth Combo moduli. Componit subsystem cum 2T2R Dual-band WLAN cum SDIO3.0 moderatoris interfaciei et Bluetooth v5.2 subsystem cum UART interfaciei moderatoris. Modulus compatibilis IEEE 802.11a/b/g/n/ac/ax vexillum maximum praebet rate PHY usque ad 1201Mbps, Bluetooth modum dualem v5.2/v4.2/v2.1 obsequium sustinet. Modulus plenam solutionem praebet pro magni-faciendi WLAN et Bluetooth machinis integratis ut OTT Pyxidas, Pyxidas Pone-top, HD Cameras, etc.
50pin dimidium foraminis pads cum 13.1*15.1*2.1mm ultra parvam profile
Frequentiae operans: 2.4~2.4835GHz vel 5.15~5.85 GHz
Support Dual-band 2T2R modus cum 20/40/80Mhz bandwidth
Support 802.11ax with OFDMA and MU-MIMO
Dual Modus Bluetooth firmamentum: Simultaneum LE et BR / EDR
potentia copia principalis DC 3.3V et 3.3V/1.8V IO potestas copia
Obstructionum Diagram

Specificationes generales
OMNIBUS Nomen |
BL-M8852BS2 |
Chipset |
RTL8852BS-CG |
WLAN Signa |
IEEE802.11a/b/g/n/ac/ax |
Hospes Interface |
SDIO pro WLAN & UART ad BT |
Antenna |
Antennas externas per medium foramen coniungere |
Dimension |
15.1*13.1*2.10mm (L*W*H) |
Potestas Supple |
VDD33=3.3V±0.2V@1100 mA (Max) VDDIO=3.3V±0.2V / 1.8V±0.1V |
Operatio Temperature |
-20℃ ad +70℃ |
operatio Umor |
X% ad XCV% RH (Non-Condensing) |
Product Dimension

Module dimensio: 15.1*13.1*2.1mm(L*W*H; Tolerantia: ±0.15mm)
Sarcina Dimensiones


Specificatio sarcina:
1. 1,000 modulorum per roll et 5,000 modulorum in arca.
2. Arca exterioris magnitudinis: 37.5*36*29cm.
3. Diameter caerulei ambitus amicae Flexilis laminae est 13 digitorum, cum tota crassitudine 28mm
(cum latitudine 24mm balteum gerens).
4. Pone 1 sarcinam agentis aridae (20g) et humiditatis chartae in singulis sacculi anti-staticis vacuo.
5. Quisque lobortis refertus est cum 5 scriniis..
Introductio
BL-M8852BS2 valde integrata est Dual-band WLAN + Bluetooth Combo moduli. Componit subsystem cum 2T2R Dual-band WLAN cum SDIO3.0 moderatoris interfaciei et Bluetooth v5.2 subsystem cum UART interfaciei moderatoris. Modulus compatibilis IEEE 802.11a/b/g/n/ac/ax vexillum maximum praebet rate PHY usque ad 1201Mbps, Bluetooth modum dualem v5.2/v4.2/v2.1 obsequium sustinet. Modulus plenam solutionem praebet pro magni-faciendi WLAN et Bluetooth machinis integratis ut OTT Pyxidas, Pyxidas Pone-top, HD Cameras, etc.
50pin dimidium foraminis pads cum 13.1*15.1*2.1mm ultra parvam profile
Frequentiae operans: 2.4~2.4835GHz vel 5.15~5.85 GHz
Support Dual-band 2T2R modus cum 20/40/80Mhz bandwidth
Support 802.11ax with OFDMA and MU-MIMO
Dual Modus Bluetooth firmamentum: Simultaneum LE et BR / EDR
potentia copia principalis DC 3.3V et 3.3V/1.8V IO potestas copia
Obstructionum Diagram

Specificationes generales
OMNIBUS Nomen |
BL-M8852BS2 |
Chipset |
RTL8852BS-CG |
WLAN Signa |
IEEE802.11a/b/g/n/ac/ax |
Hospes Interface |
SDIO pro WLAN & UART ad BT |
Antenna |
Antennas externas per medium foramen coniungere |
Dimension |
15.1*13.1*2.10mm (L*W*H) |
Potestas Supple |
VDD33=3.3V±0.2V@1100 mA (Max) VDDIO=3.3V±0.2V / 1.8V±0.1V |
Operatio Temperature |
-20℃ ad +70℃ |
operatio Umor |
X% ad XCV% RH (Non-Condensing) |
Product Dimension

Module dimensio: 15.1*13.1*2.1mm(L*W*H; Tolerantia: ±0.15mm)
Sarcina Dimensiones


Specificatio sarcina:
1. 1,000 modulorum per roll et 5,000 modulorum in arca.
2. Arca exterioris magnitudinis: 37.5*36*29cm.
3. Diameter caerulei ambitus amicae Flexilis laminae est 13 digitorum, cum tota crassitudine 28mm
(cum latitudine 24mm balteum gerens).
4. Pone 1 sarcinam agentis aridae (20g) et humiditatis chartae in singulis sacculi anti-staticis vacuo.
5. Quisque lobortis refertus est cum 5 scriniis..