Dual Modus 5G Wi-FI Module cum RF Amplifier et 3000m Range
Introductio
BL-M5623DU1 valde integrata est Dual-band WLAN + Bluetooth v5.1 modulus Combo. Componit 2T2R subsystem WLAN Dual-band et Bluetooth v5.1 subsystem. Cuius moduli compatibilis IEEE 802.11 a/b/g/n/ac vexillum maximum ratem PHY usque ad 867Mbps praebet, BT/BLE modum duplicem cum BT v5.1/v4.2/v2.1 obsequiosum praebet, plumas et inferiores sumptus pro STB、OTT、IOT et autocinetis applicationibus praebet.
Features
Frequentia operans: 2.4~2.4835GHz vel 5.15~5.85 GHz
Hostia interface est USB 2.0
IEEE Signa: IEEE 802.11a/b/g/n/ac
Wireless PHY rate potest pervenire ad 867Mbps
Support BT Ordo et BT Low Energy duplex modus operandi concurrente
Antenna externa connectere per IPEX connectors
Virtus Supple: 3.3V±0.2V principalis potentia copia
Obstructionum Diagram
![2024-06-14 08.22.44]()
Specificationes generales
OMNIBUS Nomen |
BL-M5623DU1 |
Chipset |
UWE5623DU |
WLAN Signa |
IEEE 802.11 a/b/g/n/ac |
Signa Bluetooth |
Bluetooth Core Specification v5.1/4.2/2.1 |
Hospes Interface |
USB2.0 |
Antenna |
Antenna externa connectere per IPEX connectors |
Dimension |
27.0*17.8*3mm (L*W*H) |
Potestas Supple |
DC 3.3V±0.2V @1A (Max) |
Operatio Temperature |
-20℃ ad +70℃ |
operatio Umor |
X% ad XCV% RH (Non-Condensing) |
Product Dimension
![2024-06-14 08.22.55]()
Module dimensio: 27.0mm*17.8mm*3mm (L*W*H; Tolerantia: ±0.15mm)
IPEX / MHF-1 dimensionis connector: 2.6*3.0*1.2mm (L*W*H, 2.0mm)
Sarcina Dimensiones
![w 1]()
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Specificatio sarcina:
1. 900 modulorum per volumen et 3,600 modulorum in arca.
2. Arca exterioris magnitudinis: 37.5*36*29cm.
3. Diameter caerulei environment - amicae Flexilis laminae est 13 digitorum, cum tota crassitudine 48mm
(cum latitudine 44mm balteum gerens).
4. Pone 1 sarcinam agentis aridae (20g) et humiditatis chartae in singulis sacculi anti-staticis vacuo.
5. Quisque lobortis refertum est cum 4 scriniis.
