Maximum potentia 5G Wi-fi moduli cum 5.8g frequency et arduino compatibility
Introductio
BL-M6256AS3 est altus integratur Dual-cohortis WLAN module base in SV6256p, quod combines SDIO interface, MCU, SRAM, PMU, et 1T1R WLAN MAC / BB / Radio in uno chip / bb / radio in uno chip / bb / radio in uno chip. Non compatible IEEE 802.11 A / B / G / N Latin quod praebet maximum phy rate usque 150mbps. Modulus providet humilis, summa throughput et superior RF perficientur embedded ratio, ut IP cameras, POS, Ott arcu.
Features
Operating Frequencies: 2.4 ~ 2.4835GHz et 5.15 ~ 5.85GHz
Support 802.11 A / B / G / N
Support AP / STA modus
SDIO 1.1 / 2.0 fabrica interface
DC3.3V una potentia copia
Obstructionum Diagram
Generalis specifications
OMNIBUS | BL, M6256AS3 150MBPS WLAN SDIO Module |
Chipset | Sv6256p |
WLAN signa | Ieee802.11a / b / g / n |
HOST Interface | SDIO 1.1 / 2.0 |
Antenna | Iungo ad externum antenna per ipex iungo |
Dimensio | 13.5 * 13.0 * 2.1MM (L * W * h) |
POPULUM | DC 3.3v ± 0.2V @ D M (Max) |
Operatio temperatus | -20 ℃ ad + LXX ℃ |
Operatio Umor | X% ad XCV% RH (non-condensing) |
Productum dimensionem
Module DIMENSION: 13.5 * 13.0 * 2.1MM (L * W * H; tolerantia, ± 0.15MM)
Ipex / MHF, I Connector dimensionem: 2.6 * 3.0 * 1.2mm (l * w * h, ø2.0mm)
Sarcina dimensiones
Package Specification:
1,000 modulorum per volumine et 5,000 modules per arca.
Textus Box Size: 37,5 * XXXVI * 29cm.
Diametrum hyacintho amet-amica Flexilis laminam est XIII pollices, cum totalis crassitudine 28mm (cum latitudinem 24mm portantes balteum).
Posuit I sarcina ex arida agente (20g) et I humiditas card in se anti-stabilis vacuo peram.
Quisque lobortis est facis cum V boxes.
