Princeps Power 5G Wi-FI Module cum 5.8G Frequentia et Arduino Compatibility
Introductio
BL-M6256AS3 est valde integrata duplicata WLAN basi moduli in SV6256P, quae interfaciem, MCU, SRAM, PMU et 1T1R WLAN MAC/BB/Radio coniungit in uno chip. Compatibile IEEE 802.11 a/b/g/n vexillum et praebet maximum ratem PHY usque ad 150Mbps. Modulus humilis potentiam, summam throughput et superiorem RF effectus praebet pro infixa systemate, sicut IP cameras, POS, OTT Box.
Features
Frequentiae operans: 2.4~2.4835GHz vel 5.15~5.85 GHz
Support 802.11 a/b/g/n
Support AP / STA modus
SDIO 1.1/2.0 fabrica interface
DC3.3V una potentia copia
Obstructionum Diagram
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Specificationes generales
OMNIBUS Nomen |
BL-M6256AS3 150Mbps WLAN SDIO OMNIBUS |
Chipset |
SV6256P |
WLAN Signa |
IEEE802.11a/b/g/n |
Hospes Interface |
SDIO 1.1/2.0 |
Antenna |
Antenna externa connectere per IPEX iungo |
Dimension |
13.5* 13.0*2.1mm (L*W*H) |
Potestas Supple |
DC 3.3V±0.2V @500 mA (Max) |
Operatio Temperature |
-20℃ ad +70℃ |
operatio Umor |
X% ad XCV% RH (Non-Condensing) |
Product Dimension
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Module dimensio: 13.5*13.0*2.1mm (L*W*H; Tolerantia: ±0.15mm)
IPEX / MHF-1 dimensionis connector: 2.6*3.0*1.2mm (L*W*H, 2.0mm)
Sarcina Dimensiones
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Specificatio sarcina:
1,000 modulorum per roll et 5,000 modulorum in arca.
Arca exterior magnitudo: 37.5*36*29cm.
Diameter caerulei environment - amicae Flexilis laminae est 13 digitorum, cum tota crassitudine 28mm (cum latitudine 24mm cinguli gestantis).
Pone 1 sarcinam agentis aridae (20g) et 1 humiditatis chartae in singulis sacculi vacui anti-statici.
Quisque lobortis cum 5 scriniis refertum est.
