Home / Products / Wi-FI amet / 5G Wi-FI OMNIBUS / M1102AS2 1T1R 802.11a/n/ac WiFi5+GNSS Module

loading

Share to:
facebook sharing button
Twitter sharing button
linea participatio puga
wechat sharing button
sharingin button sharing
pinterest sharing button
whatsapp sharing button
sharethis sharing button

M1102AS2 1T1R 802.11a/n/ac WiFi5+GNSS Module

  • HiSilicon Hi102A
  • SDIO
  • 5GHz
  • 433Mbps
  • 1x1 1T1R
  • 31*20*3mm
Availability:
Quantitas:
  • BL-M1102AS2

  • LB-LINK

  • HISILICON

  • 1T1R

  • SDIO Interface

  • Wi-Fi 5 (802.11ac)

Introductio

BL-1102AS2 valde integrata est 5GHz unius cohortis summus potentiae wireless moduli basin Hi1102A, Integrati PMU、CMU、MAC、PHY、RF et aliorum modulorum, altae integrationis, altae exsecutionis wireless communicationis moderatoris unius chip. Modulus in alta potestate FEM aedificavit et modum 5/10MHz angustum band sustinet, signanter dilatans WLAN communicationis distantiam, idealis applicationum transmissionis video longi-range wireless sicut IP camera et UAV.


Features

  • Frequentia operans: 4.905~4.940GHz; 5.15~5.85 GHz; 5.88~5.9GHz;

  • IEEE Signa: IEEE 802.11 a (Narrowband Mode)

  • Sustinet 5/10MHz narrowband cum 1T1R .

  • Antenna externa connectere per MHF1/IPEX1 connectors

  • Hostia interface est SDIO3.0, compatible cum SDIO2.0

  • DC 5V & VBAT 3.7V


Obstructionum Diagram

2025-12-30 105206

Specificationes generales

OMNIBUS Nomen

BL-M1102AS2

Chipset

HiSilicon Hi1102A

WLAN Signa

IEEE 802.11 a (Narrowband Mode)

Modus working

AP vel Statio cum 5/10MHz narrowband

Hospes Interface

SDIO3.0 compatible SDIO2.0

Antenna

Antenna externa connectere per IPEX connexiones

Dimension

31*20*3mm (L*W*H)

Potestas Supple

VBAT 3.7V @600mA (Max) & DC 5.0V@ 1800mA (Max)

Operatio Temperature

-20℃ ad +70℃

operatio Umor

X% ad XCV% RH (Non-Condensing)


Product Dimension

2025-12-30 105336

Module dimensio: 31.0mm*20.0mm*3.0mm(L*W*H; Tolerantia: ±0.3mm_L/W, ±0.2mm_H)

IPEX / MHF-1 dimensionis connector: 3.0*2.6*1.25mm (L*W*H, Ø2.0mm)


Sarcina Dimensiones

1

Specificatio sarcina:

1. 48 moduli per pustula et 384 moduli clypei 384 opercula silicone pads per cistae scelerisque.

2. Pustula membrana filo alligata atque in sacculo vacuo anti-statico immittitur.

3. Pone 1 sacculum globuli aridae (20g) et 1 pc 3 punctum humiditatis chartae in singulis sacculis anti-staticis vacuum.

4. Arca exterior magnitudo est 35.2*21.5*15.5cm.



Previous: 
Next: 

Related Articles

contentus inanis est!

Guangming District, Shenzhen, sicut basis investigationis et evolutionis et fori servitii, et instructa plusquam 10,000m² automated productio officinae et centra cellae logisticae.

Velox Vincula

Aliquam Nuntius
Contact Us

Product Category

Contact Us

86-   + 13923714138
+86  Negotia 13923714138
:  Email  sales@lb-link.com
Technical auxilium info@lb-link.com
Complaint   inscriptio: queri@lb-link.com
   Shenzhen Headquarter: 10-11/F, Aedificium A1, Huaqiang idea parcum, Guanguang Rd, Guangming novum districtum, Shenzhen, Guangdong, Sinis.
 Shenzhen Factory: 5F, Aedificium C, No.32 Dafu Rd, Longhua District, Shenzhen, Guangdong, Sinis.
Jiangxi Factory: LB-Link Industrial Park, Qinghua Rd, Ganzhou, Jiangxi, Sinis.
Copyright © 2024 Shenzhen Bilian Electronic Co, Ltd. Omnia iura reservata. | Sitemap | Privacy Policy