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BL-M1102AS2
LB-LINK
HISILICON
1T1R
SDIO Interface
Wi-Fi 5 (802.11ac)
BL-1102AS2 valde integrata est 5GHz unius cohortis summus potentiae wireless moduli basin Hi1102A, Integrati PMU、CMU、MAC、PHY、RF et aliorum modulorum, altae integrationis, altae exsecutionis wireless communicationis moderatoris unius chip. Modulus in alta potestate FEM aedificavit et modum 5/10MHz angustum band sustinet, signanter dilatans WLAN communicationis distantiam, idealis applicationum transmissionis video longi-range wireless sicut IP camera et UAV.
Features
Frequentia operans: 4.905~4.940GHz; 5.15~5.85 GHz; 5.88~5.9GHz;
IEEE Signa: IEEE 802.11 a (Narrowband Mode)
Sustinet 5/10MHz narrowband cum 1T1R .
Antenna externa connectere per MHF1/IPEX1 connectors
Hostia interface est SDIO3.0, compatible cum SDIO2.0
DC 5V & VBAT 3.7V
Obstructionum Diagram

Specificationes generales
OMNIBUS Nomen |
BL-M1102AS2 |
Chipset |
HiSilicon Hi1102A |
WLAN Signa |
IEEE 802.11 a (Narrowband Mode) |
Modus working |
AP vel Statio cum 5/10MHz narrowband |
Hospes Interface |
SDIO3.0 compatible SDIO2.0 |
Antenna |
|
Dimension |
31*20*3mm (L*W*H) |
Potestas Supple |
VBAT 3.7V @600mA (Max) & DC 5.0V@ 1800mA (Max) |
Operatio Temperature |
-20℃ ad +70℃ |
operatio Umor |
X% ad XCV% RH (Non-Condensing) |
Product Dimension

Module dimensio: 31.0mm*20.0mm*3.0mm(L*W*H; Tolerantia: ±0.3mm_L/W, ±0.2mm_H)
IPEX / MHF-1 dimensionis connector: 3.0*2.6*1.25mm (L*W*H, Ø2.0mm)
Sarcina Dimensiones

Specificatio sarcina:
1. 48 moduli per pustula et 384 moduli clypei 384 opercula silicone pads per cistae scelerisque.
2. Pustula membrana filo alligata atque in sacculo vacuo anti-statico immittitur.
3. Pone 1 sacculum globuli aridae (20g) et 1 pc 3 punctum humiditatis chartae in singulis sacculis anti-staticis vacuum.
4. Arca exterior magnitudo est 35.2*21.5*15.5cm.
BL-1102AS2 valde integrata est 5GHz unius cohortis summus potentiae wireless moduli basin Hi1102A, Integrati PMU、CMU、MAC、PHY、RF et aliorum modulorum, altae integrationis, altae exsecutionis wireless communicationis moderatoris unius chip. Modulus in alta potestate FEM aedificavit et modum 5/10MHz angustum band sustinet, signanter dilatans WLAN communicationis distantiam, idealis applicationum transmissionis video longi-range wireless sicut IP camera et UAV.
Features
Frequentia operans: 4.905~4.940GHz; 5.15~5.85 GHz; 5.88~5.9GHz;
IEEE Signa: IEEE 802.11 a (Narrowband Mode)
Sustinet 5/10MHz narrowband cum 1T1R .
Antenna externa connectere per MHF1/IPEX1 connectors
Hostia interface est SDIO3.0, compatible cum SDIO2.0
DC 5V & VBAT 3.7V
Obstructionum Diagram

Specificationes generales
OMNIBUS Nomen |
BL-M1102AS2 |
Chipset |
HiSilicon Hi1102A |
WLAN Signa |
IEEE 802.11 a (Narrowband Mode) |
Modus working |
AP vel Statio cum 5/10MHz narrowband |
Hospes Interface |
SDIO3.0 compatible SDIO2.0 |
Antenna |
|
Dimension |
31*20*3mm (L*W*H) |
Potestas Supple |
VBAT 3.7V @600mA (Max) & DC 5.0V@ 1800mA (Max) |
Operatio Temperature |
-20℃ ad +70℃ |
operatio Umor |
X% ad XCV% RH (Non-Condensing) |
Product Dimension

Module dimensio: 31.0mm*20.0mm*3.0mm(L*W*H; Tolerantia: ±0.3mm_L/W, ±0.2mm_H)
IPEX / MHF-1 dimensionis connector: 3.0*2.6*1.25mm (L*W*H, Ø2.0mm)
Sarcina Dimensiones

Specificatio sarcina:
1. 48 moduli per pustula et 384 moduli clypei 384 opercula silicone pads per cistae scelerisque.
2. Pustula membrana filo alligata atque in sacculo vacuo anti-statico immittitur.
3. Pone 1 sacculum globuli aridae (20g) et 1 pc 3 punctum humiditatis chartae in singulis sacculis anti-staticis vacuum.
4. Arca exterior magnitudo est 35.2*21.5*15.5cm.
contentus inanis est!