Introductio
BL-M7663BU7 valde integrata est Dual-band WLAN + Bluetooth v5.1 modulus Combo. Subsystem cum 2T2R Dual-band WLAN et Bluetooth v5.1 subsystem coniungit. Modulus hic congruens cum IEEE 802.11a/b/g/n/ac vexillum et maximum ratem PHY usque ad 867Mbps praebet, BR/EDR et BLE modum dualem sustinet, pluma-ditas connectivity in signis altis offerens, et certiora, cost-effectiva, ab longinquo spatio liberans.
Features
Frequentias operans: 2.4~2.4835GHz et 5.15~5.85 GHz
Hostia interface est USB2.0
IEEE Signa: IEEE 802.11a/b/g/n/ac
Wireless PHY rate potest pervenire ad 867Mbps
Bluetooth v5.1 systema subsidia
Antennae PCB typis constructum in moduli
Potestas Supple: DC 5V±0.3V
Obstructionum Diagram
![2024-09-27 10.46.24]()
Specificationes generales
OMNIBUS Nomen |
BL-M7663BU7 |
Chipset |
MT7663BUN |
WLAN Signa |
IEEE802.11a/b/g/n/ac |
Hospes Interface |
USB2.0 pro WLAN & BT |
Antenna |
In tabula PCB antennae typis impressae |
Dimension |
64.0mm x 33.0mm x 5.5mm (L*W*H) |
Potestas Supple |
DC 5V±0.3V 1500mA (Max) |
Operatio Temperature |
-20℃ ad +70℃ |
operatio Umor |
X% ad XCV% RH (Non-Condensing) |
Product Dimension
![2024-09-27 10.46.37]()
Modulus dimensio: 64.0*33.0*5.5mm (L*W*H; Tolerantia: ±0.3mm_L/W, ±0.5mm_H)
Sarcina Dimensiones
![1]()
Specificatio sarcina:
1. 16 modulorum per pustula et 448 modulorum in arca.
2. Pustula membrana filo alligata atque in sacculo vacuo anti-statico immittitur.
3. Pone 1 sacculum globuli aridae (20g) et 1 humiditatis chartae in singulis sacculi anti-staticis vacuo.
4. Arca exterior magnitudo est 43*35.5*16cm.
