Introductio
BL-m7663bu7 est altus integrated dual-cohortem Wlan + Bluetooth v5.1 combo moduli. Hoc combines 2t2r Dual-Band Wlan Subsystem et Bluetooth V5.1 Subsystem. This module compatible with IEEE 802.11a/b/g/n/ac standard and provides the maximum PHY rate up to 867Mbps, it supports BR/EDR and BLE dual mode , offering feature-rich wireless connectivity at high standards, and delivering reliable, cost-effective throughput from an extended distance.
Features
Operating Frequencies: 2.4 ~ 2.4835GHz et 5.15 ~ 5.85GHz
Exercitum interface est USB2.0
IEEE Signa: IEEE 802.11A / B / G / N / AC
Wireless Phy rate potest pervenire ad 867mbps
Supports Bluetooth V5.1 System
PCB typis antennas aedificare in moduli
Vox Supple: DC 5v ± 0.3V
Obstructionum Diagram
Generalis specifications
OMNIBUS | BL, M7663BU7 |
Chipset | Mt7663bun |
WLAN signa | Ieee802.11a / b / g / n / ac |
HOST Interface | Usb2.0 ad Wlan & Bt |
Antenna | De Board PCB typis antennas |
Dimensio | 64.0mm x 33.0mm x 5.5mm (L * w * h) |
POPULUM | DC 5V ± 0.3v 1500MA (Max) |
Operatio temperatus | -20 ℃ ad + LXX ℃ |
Operatio Umor | X% ad XCV% RH (non-condensing) |
Productum dimensionem
Module DIMENSION: 64.0 * 33.0 * 5.5mm (L * W * H; tolerantia, ± 0.3mm_l / w, ± 0.5mm_h)
Sarcina dimensiones
Package Specification:
I. XVI Modules per Blister laminam et CDXLVIII Modules per arca.
II. Et blister tenetur cum filum membrana et posuit in anti-stabilis vacuo peram.
III. Pone I peram arida grana (20g) et I humiditas card in se anti-stabilis vacuo peram.
IV. Quod exterius arca magnitudine est XLIII * 35.5 * 16cm.
