In domo / Productus / Wi-fi moduli / 2.4g Wi-fi moduli / M8801MS4G 1T1R 802.11b/g/n WiFi Module

loading

Share est:
Facebook Sharing Button
Twitter Socius Button
Line sharing button
Weckat Sharing Button
LinkedIn Sharing Button
Pinterest Sharing Button
Whatsapp Sharing Button
Sharing Sharing Button

M8801MS4G 1T1R 802.11b/g/n WiFi Module

  • 88W8801B0-NMDI/AZ
  • SDIO
  • 802.11b/g/n
  • 2.4GHz
  • 72.2Mbps
  • 1x1 1T1r
  • 13*13.5*2mm
Availability:
Quantitas:
  • BL-M8801MS4G

  • Lb-link

  • Sine BT

  • NXP

  • 1t1r

  • SDIO Interface

  • Wi-fi IV (802.11N)

Introductio

BL-M8801MS4 productum est basis in NXP 88W8801. Operatur ad 2.4~2.4835GHz et IEEE 802.11b/g/g/n 1T1R cum High Throughput data rate pro WLAN producta sustinet. Etiam IEEE802.11i protocollum salutis adiuvat, una cum IEEE 802.11e norma servitii qualitatis. Modulus interfacem SDIO praebet cum SDIO 1.1/2.0, et connexionem per antenna externam per longum intervallum firmum, altum ratem efficiunt. Potest efficere functionem retis wireless in laptop/desktop/MED et alia machinis wireless facile.




Features

  • Frequentia operans: 2.4~2.4835GHz

  • Host Interface:SDIO 2.0 pro WLAN

  • Wireless PHY rate usque ad 72.2Mbps

  • 3.3V principalis potentia et 3.3VI/O potestas



Obstructionum Diagram

3



Generalis specifications


OMNIBUS Nomen

BL-M8801MS4G

Chipset

88W8801B0-NMDI/AZ

WLAN Standard

IEEE 802.11 b/g/n

Hospes Interface

SDIO 2.0 pro WLAN

Antenna

Antennae externae per medium foramen coniungere

Dimensio

13.0*13.5*2.0mm (L*W*H)

Potestas Supple

DC 3.3V±0.2V @ 360 mA ( Max)

Operatio Temperature

-40℃ ad +85℃

operatio Umor

X% ad XCV% RH (Non-Condensing)



Productum dimensionem

4


Module dimensio: 13.0*13.5*2.0mm(L*W*H; Tolerantia: ±0.3mm_L/W, ±0.2mm_H)



Sarcina dimensiones


5

Package Specification:

1. 150 modulorum pustularum lamellarum et 3,000 modulorum in arca.

2. Pustula membrana filo alligata atque in sacculo vacuo anti-statico immittitur.

3. Pone 1 sacculum globuli aridae (20g) et 1 humiditatis chartae in singulis sacculi anti-staticis vacuo.

4. Arca exterior magnitudo est 35.2*21.5*15.5cm.





Previous: 
Next: 

Related Articles

Content vacat!

Guangming District, Shenzhen, ut a investigationis et progressionem et foro ministerium basis et instructum magis quam 10,000m² automated productio official et logistics warehousing centers.

Quick Links

Relinquere nuntium
Contact Us

Uber genus

Contact Us

   + 86- 13923714138
  LXXXVI 13923714138
   Business Email: sales@lb-link.com
   Technical Support: info@lb-link.com
   querimonia Email: querela@lb-link.com
   Shenzhen headquarter: 10-11 / F, A1 A1, Huaqiang ideam Park, Guangenang RD, Guangming New District, Shenzhen, Guangdong, Sina.
 Shenzhen Factory: 5f, Aedificiumium C, No.32 Dafu Rd, Longhua District, Shenzhen, Guangdong, Sinis.
Jiangxi Factory: LB-Link Industrial Park, Qingua RD, Ganzhou, Jiangxi, Sinis.
Copyright © 2024 Shenzhen Bilian Electronic Co., Ltd. All Rights Reserved. Squama Sitemap | Privacy Policy