Introductio
BL-M8800MC1 est valde integratus IOT modulus qui cum WLAN subsystem, Bluetooth subsystem, MCU subsystem, Memoria subsystem, PMU subsystem, et plures aliae functiones cum divitiis interfaces periphericis componunt. Eius notae parvae magnitudinis, multi-munerum, magni effectus, humilis potentiae consummatio sunt specimen flexibilium applicationum Internet rerum innixarum WLAN et B communicationis.
Features
• 240MHz Cortex-M4F CPU (cum MPU & FPU)
• 608KB SRAM, 704KB ROM, 16MB Flash
• GPIO-multiplexi peripherales: SDIO/SPI/USB/UART/I2S/I2C/PWM/ADC
• RF range: 2.4~2.4835GHz
• Wi-FI 802.11b/g/n/ax (20/40MHz, 1T1R, usque ad 286.8Mbps PHY rate)
• Integrated PMU: Tantum requirit 3.3V main+1.8V/3.3VI/O potentia
Obstructionum Diagram
![2025-04-28 15.05.15]()
Generalis specifications
OMNIBUS |
BL, M8800mc1 |
Chipset |
AIC8800MC |
WLAN Signa |
IEEE802.11b/g/n/ax |
BT Specification |
Bluetooth Core Specification v5.2/v4.2/v2.1 |
HOST Interface |
USB pro WLAN + B vel SDIO pro WLAN & UART pro B* |
Antenna |
Antennae externae per medium foramen caudex coniungere |
Dimensio |
12.0* 12.0*2.1mm |
POPULUM |
3.3V±0.2V summa potentia copia @600mA (Max) 3.3V±0.2V vel 1.8V±0.1VI/O copia |
Operatio temperatus |
-20 ℃ ad + LXX ℃ |
Operatio Umor |
X% ad XCV% RH (non-condensing) |
Productum dimensionem
![2025-04-28 15.08.07]()
Modulus dimensio: 12.0*12.0*2.1mm (L*W*H; Tolerantia: ±0.3mm_L/W, ±0.2mm_H)
Sarcina dimensiones
![图片 I]()
![2]()
Package Specification:
I. 1,000 modulorum per volumine et 5,000 modules per arca.
II. Puteus Size: 37,5 * * 29cm 37.5.
III. Diametrum ex hyacintho amet-amica Flexilis laminam est XIII pollices, cum totalis crassitudine 28mm (cum latitudinem 24mm portantes balteum).
4. Pone 1 sarcinam agentis aridae (20g) et 1 humiditatis chartae in singulis sacculi vacui anti-statici.
V. Quisque lobortis est cum V boxes.
