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BL-M8800DS5-L
LB-LINK
V5.2
AIC
1T1R
SDIO Interface
Introduction
BL-M8800DS5-L is a highly integrated WLAN + B Combo module base on AIC8800DL chip, which combines a 1T1R WLAN subsystem and a B v5.2 subsystem.This module compatible IEEE 802.11b/g/n/ax standard and provides the maximum PHY rate up to 287Mbps, offering feature-rich wireless connectivity at high standards, delivering reliable, cost-effective and high throughput from an extended distance.
Features
Operating Frequencies: 2.4~2.4835GHz
Wireless PHY rate can reach up to 287Mbps with 20/40MHz bandwidth
Host Interfaces are SDIO or USB 2.0 (Two interfaces cannot be used simultaneously)
Support STA, AP, WLAN Direct modes concurrently
Block Diagram
General Specifications
Module Name | BL-M8800DS5-L |
Chipset | AIC8800DL |
WLAN Standards | IEEE802.11b/g/n/ax |
B Specification | B Core Specification v5.2 |
Host Interface | SDIO for WLAN & UART for B or USB for WLAN + B |
Antenna | |
Dimension | 12.0*12.0*1.7mm |
Power Supply | 3.3V main power supply @600mA (Max) 3.3V or 1.8V I/O power supply |
Operation Temperature | -20℃ to +70℃ |
Operation Humidity | 10% to 95% RH (Non-Condensing) |
Product Dimension
Module dimension: 12.0*12.0*1.7mm (L*W*H; Tolerance: ±0.3mm_L/W, ±0.2mm_H)
Package Dimensions
Package specification:
1. 2,000 modules per roll and 10,000 modules per box.
2. Outer box size: 37.5*36*29cm.
3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm (with a width of 24mm carrying belt).
4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag.
5. Each carton is packed with 5 boxes.
Introduction
BL-M8800DS5-L is a highly integrated WLAN + B Combo module base on AIC8800DL chip, which combines a 1T1R WLAN subsystem and a B v5.2 subsystem.This module compatible IEEE 802.11b/g/n/ax standard and provides the maximum PHY rate up to 287Mbps, offering feature-rich wireless connectivity at high standards, delivering reliable, cost-effective and high throughput from an extended distance.
Features
Operating Frequencies: 2.4~2.4835GHz
Wireless PHY rate can reach up to 287Mbps with 20/40MHz bandwidth
Host Interfaces are SDIO or USB 2.0 (Two interfaces cannot be used simultaneously)
Support STA, AP, WLAN Direct modes concurrently
Block Diagram
General Specifications
Module Name | BL-M8800DS5-L |
Chipset | AIC8800DL |
WLAN Standards | IEEE802.11b/g/n/ax |
B Specification | B Core Specification v5.2 |
Host Interface | SDIO for WLAN & UART for B or USB for WLAN + B |
Antenna | |
Dimension | 12.0*12.0*1.7mm |
Power Supply | 3.3V main power supply @600mA (Max) 3.3V or 1.8V I/O power supply |
Operation Temperature | -20℃ to +70℃ |
Operation Humidity | 10% to 95% RH (Non-Condensing) |
Product Dimension
Module dimension: 12.0*12.0*1.7mm (L*W*H; Tolerance: ±0.3mm_L/W, ±0.2mm_H)
Package Dimensions
Package specification:
1. 2,000 modules per roll and 10,000 modules per box.
2. Outer box size: 37.5*36*29cm.
3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm (with a width of 24mm carrying belt).
4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag.
5. Each carton is packed with 5 boxes.
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