Home / Solutions / Solutio: Ultra-Slim Wireless Connectivity for Compact & Ultra-Thin Devices| BL-M8852BP6

Solutio: Ultra-Slim Wireless Connectivity for Compact & Ultra-Thin Devices| BL-M8852BP6

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BL-M8852BP6 | WiFi 6 + Bluetooth 5.2 Soldeded SMT OMNIBUS SOLUTIO

Overview

Hodiernae laptops ultra tenues, ostentationes graciles callidi, et systemata compacta systemata wireless connectivity solutiones postulant, quae altam effectionem, factorem minimalem, et longi temporis fidem. Moduli M.2 moduli saepe angustias altitudinis, complexionem conventus, et tremorem relatas periculorum constantiam, praesertim in summo volumine, consiliorum spatio constricto, inducunt.

Solutio Bl -M8852BP6 has provocationes alloquitur cum wireless combo moduli solidati-descendenti potestatem a Realtek RTL8852BE-CG chipset. Comitat WiFi 6 (802.11ax) connectivity summus et Bluetooth 5.2 duplicem modum operationis in involucro ultra-pacto M.2 1216-S4, ut collocationem directam SMT sine M.2 nervum requirat.

Haec solutio turnkey wireless optimized pro applicationibus ubi omnis millimeter numerat.

BL-M8852BP6 ultra-gracili WiFi 6 + Bluetooth 5.2 moduli pro tenuibus laptops.png

Key provocationes Addressed

  • Extremae altitudinis angustiae in ultra-tenues gb designs

  • Reliability periculum ex nasse modulorum in summus vibrationis ambitibus

  • Princeps BOM et conventus sumptibus a discretis RF componentibus

  • WiFi-Bluetooth coexistentia impedimentum in pacto layout

  • Latency et obstructio in ambitibus multi-usoris connexis

Solutio volutpat

1. ultra-Slim solidata forma factor

  • Forma Factor : M.2 1216-S4 solidata moduli

  • Dimensiones : 16.0 × 12.0 1.7 mm

  • Dirige PCB SMT ecclesia tollit M.2 iungo altitudo

  • Specimen pro tabellis ultra tenuibus, tabulis 2-in-1, et systematibus compactis infixa

2. Summus euismod WiFi 6 (802.11ax)

  • Dual-band: 2.4 GHz + 5 GHz

  • 2T2R, 20/40/80 subsidium canalis MHz

  • Max PHY rate: 1201 Mbps

  • Sustinet OFDMA & MU-MIMO pro humili latency multi-usore tradendo

  • Host Interface: Plu 1.1

3. Bluetooth 5.2 Dual-Modus Connectivity

  • Bluetooth 5.2 (retro compatible cum v4.2 / v2.1)

  • Simultaneum LE + BR/EDR operandi

  • Optimized pro audio, HID periphericis, scanneribus et IoT sensoriis

  • Hospes Interface: USB 2.0 Plena-Speed

  • Antenna: 2× MHF4 / IPEX4 connectors

4. Industrial-Grade Reliability

  • Temperatus operans: -20℃ ad +70℃

  • Virtutis copia: 3.3V ± 0.2V, apicem 1.5A

  • ESD praesidium: 2 kv (HBM)

  • Reflow solida compatible (max 250℃, ≤ 2 refluit)

  • Umor range: X% -95% RH (non-condensatione)

5. Massa Productio Friendly

  • Tape et turbabuntur packaging pro SMT productio lineae

  • Integrati diplexores et administratio potestatis

  • Firmum WiFi-Bluetooth convictus

  • PCB redigit layout multiplicitatem et consilium in tempore

Scopum Applications

Ultra-Thines Laptops & 2-in-1 Tabulettae

Gracile chassis consilium a 1.7mm profile para, cum celeritate WiFi 6 pro 4K effusis et amplis fasciculi translationibus, et stabilis Bluetooth pro stilo, tincidunt, et periphericis audio.

Gracili Smart TV & Digital Signage

Foedus extensionis pro ostensionibus angusto-bezelis, cum instrumentis duplicatis WiFi pro 4K/8K effusis et Bluetooth pro remotis dominiis, sonis et machinis audio.

Mini PCs, Pone Top Pyxidas & Embedded Computers

Minimum profile moduli clausuras mini aptat, altas tradens propter nubem officia et applicationes instrumentorum, cum certis RF perficiendis in casingibus metallicis.

Portable Industrial Terminals & HMIs

Lata temperatura amplis pro ambitibus industrialibus, vibratione resistentibus conventum solidatum, WiFi 6 pro reali temporis notitia uplink, et Bluetooth 5.2 pro scanneribus, sensoriis et periphericis.

Dolor Home & IoT Edge Devices

Minima magnitudo pro compacto ferramento domus callidi, optimized pro semper-in machinis connexis cum stabili 2.4G/5G vagandi et connectivity sensoris.

Solutio Specificationes

Parameter

Detail

OMNIBUS Model

BL-M8852BP6

Chipset

Realtek RTL8852BE-CG

WiFi Standard

802.11a/b/g/n/ac/ax (WiFi 6)

Bluetooth

5.2 Dual-Modo (LE + BR/EDR)

Forma factor

M.2 1216-S4 Soldered

Dimensiones

16.0 × 12.0 1.7 mm

Interface

Plu 1.1 (WLAN) + USB 2.0 FS (BT)

Antenna

2× MHF4/IPEX4

Operatio Temp

-20℃ ad +70℃

Potestas

3.3V ± 0.2V

Quid elige haec SOLUTIO

  • Dat ultra-gracilis productum consilia sine wireless perficientur sacrificare

  • Excluditur ostium tabernaculi relatas proventus solidatae constructione

  • Reduces BOM et conventum sumptibus pro magno volumine productionis

  • Tradat firmum WiFi 6 + Bluetooth 5.2 connectivity in uno pacto moduli

  • Subnixa LB-LINK machinalis turmas ad designandum in, layout, ac coegi integrationem

Accipere Support & Exempla

Petitio data schedae, PCB vestigiorum, recognitiones schismaticae, exemplaria, seu consuetudo integrationis subsidii:

Guangming District, Shenzhen, sicut basis investigationis et progressionis et servitii mercatus et instructus plus quam 10,000 millia automated productionis officinarum et sedium logisticarum horreorum.

Velox Vincula

Aliquam Nuntius
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