Views: 0 Author: Site Editor Publish Time: 2026-05-01 Origin: Site
Hodiernae laptops ultra tenues, ostentationes graciles callidi, et systemata compacta systemata wireless connectivity solutiones postulant, quae altam effectionem, factorem minimalem, et longi temporis fidem. Moduli M.2 moduli saepe angustias altitudinis, complexionem conventus, et tremorem relatas periculorum constantiam, praesertim in summo volumine, consiliorum spatio constricto, inducunt.
Solutio Bl -M8852BP6 has provocationes alloquitur cum wireless combo moduli solidati-descendenti potestatem a Realtek RTL8852BE-CG chipset. Comitat WiFi 6 (802.11ax) connectivity summus et Bluetooth 5.2 duplicem modum operationis in involucro ultra-pacto M.2 1216-S4, ut collocationem directam SMT sine M.2 nervum requirat.
Haec solutio turnkey wireless optimized pro applicationibus ubi omnis millimeter numerat.
Extremae altitudinis angustiae in ultra-tenues gb designs
Reliability periculum ex nasse modulorum in summus vibrationis ambitibus
Princeps BOM et conventus sumptibus a discretis RF componentibus
WiFi-Bluetooth coexistentia impedimentum in pacto layout
Latency et obstructio in ambitibus multi-usoris connexis
Forma Factor : M.2 1216-S4 solidata moduli
Dimensiones : 16.0 × 12.0 1.7 mm
Dirige PCB SMT ecclesia tollit M.2 iungo altitudo
Specimen pro tabellis ultra tenuibus, tabulis 2-in-1, et systematibus compactis infixa
Dual-band: 2.4 GHz + 5 GHz
2T2R, 20/40/80 subsidium canalis MHz
Max PHY rate: 1201 Mbps
Sustinet OFDMA & MU-MIMO pro humili latency multi-usore tradendo
Host Interface: Plu 1.1
Bluetooth 5.2 (retro compatible cum v4.2 / v2.1)
Simultaneum LE + BR/EDR operandi
Optimized pro audio, HID periphericis, scanneribus et IoT sensoriis
Hospes Interface: USB 2.0 Plena-Speed
Antenna: 2× MHF4 / IPEX4 connectors
Temperatus operans: -20℃ ad +70℃
Virtutis copia: 3.3V ± 0.2V, apicem 1.5A
ESD praesidium: 2 kv (HBM)
Reflow solida compatible (max 250℃, ≤ 2 refluit)
Umor range: X% -95% RH (non-condensatione)
Tape et turbabuntur packaging pro SMT productio lineae
Integrati diplexores et administratio potestatis
Firmum WiFi-Bluetooth convictus
PCB redigit layout multiplicitatem et consilium in tempore
Gracile chassis consilium a 1.7mm profile para, cum celeritate WiFi 6 pro 4K effusis et amplis fasciculi translationibus, et stabilis Bluetooth pro stilo, tincidunt, et periphericis audio.
Foedus extensionis pro ostensionibus angusto-bezelis, cum instrumentis duplicatis WiFi pro 4K/8K effusis et Bluetooth pro remotis dominiis, sonis et machinis audio.
Minimum profile moduli clausuras mini aptat, altas tradens propter nubem officia et applicationes instrumentorum, cum certis RF perficiendis in casingibus metallicis.
Lata temperatura amplis pro ambitibus industrialibus, vibratione resistentibus conventum solidatum, WiFi 6 pro reali temporis notitia uplink, et Bluetooth 5.2 pro scanneribus, sensoriis et periphericis.
Minima magnitudo pro compacto ferramento domus callidi, optimized pro semper-in machinis connexis cum stabili 2.4G/5G vagandi et connectivity sensoris.
Parameter |
Detail |
OMNIBUS Model |
BL-M8852BP6 |
Chipset |
Realtek RTL8852BE-CG |
WiFi Standard |
802.11a/b/g/n/ac/ax (WiFi 6) |
Bluetooth |
5.2 Dual-Modo (LE + BR/EDR) |
Forma factor |
M.2 1216-S4 Soldered |
Dimensiones |
16.0 × 12.0 1.7 mm |
Interface |
Plu 1.1 (WLAN) + USB 2.0 FS (BT) |
Antenna |
2× MHF4/IPEX4 |
Operatio Temp |
-20℃ ad +70℃ |
Potestas |
3.3V ± 0.2V |
Dat ultra-gracilis productum consilia sine wireless perficientur sacrificare
Excluditur ostium tabernaculi relatas proventus solidatae constructione
Reduces BOM et conventum sumptibus pro magno volumine productionis
Tradat firmum WiFi 6 + Bluetooth 5.2 connectivity in uno pacto moduli
Subnixa LB-LINK machinalis turmas ad designandum in, layout, ac coegi integrationem
Petitio data schedae, PCB vestigiorum, recognitiones schismaticae, exemplaria, seu consuetudo integrationis subsidii: