Today’s ultra-thin laptops, slim smart displays, and compact embedded systems demand wireless connectivity solutions that balance high performance, minimal form factor, and long-term reliability. Socketed M.2 modules often introduce height constraints, assembly complexity, and vibration-related reliability risks—especially in high-volume, space-constrained designs.
The BL-M8852BP6 solution addresses these challenges with a fully integrated, soldered-down wireless combo module powered by the Realtek RTL8852BE-CG chipset. It combines WiFi 6 (802.11ax) high-speed connectivity and Bluetooth 5.2 dual-mode operation in an ultra-compact M.2 1216-S4 package, enabling direct SMT placement without requiring an M.2 socket.
This turnkey wireless solution is optimized for applications where every millimeter counts.
Key Challenges Addressed
Extreme height constraints in ultra-thin chassis designs
Reliability risks from socketed modules in high-vibration environments
High BOM and assembly costs from discrete RF components
WiFi-Bluetooth coexistence interference in compact layouts
Latency and congestion in multi-user connected environments
Solution Highlights
1. Ultra-Slim Soldered Form Factor
Form Factor: M.2 1216-S4 soldered module
Dimensions: 16.0 × 12.0 × 1.7 mm
Direct PCB SMT assembly eliminates M.2 connector height
Ideal for ultra-thin notebooks, 2-in-1 tablets, and compact embedded systems
2. High-Performance WiFi 6 (802.11ax)
Dual-band: 2.4 GHz + 5 GHz
2T2R, 20/40/80 MHz channel support
Max PHY rate: 1201 Mbps
Supports OFDMA & MU-MIMO for low-latency multi-user transmission
Host Interface: PCIe 1.1
3. Bluetooth 5.2 Dual-Mode Connectivity
Bluetooth 5.2 (backward compatible with v4.2 / v2.1)
Simultaneous LE + BR/EDR operation
Optimized for audio, HID peripherals, scanners, and IoT sensors
Host Interface: USB 2.0 Full-Speed
Antenna: 2× MHF4 / IPEX4 connectors
4. Industrial-Grade Reliability
Operating temperature: -20℃ to +70℃
Power supply: 3.3V ±0.2V, peak 1.5A
ESD protection: 2 kV (HBM)
Reflow solder compatible (max 250℃, ≤ 2 reflows)
Humidity range: 10%–95% RH (non-condensing)
5. Mass Production Friendly
Tape-and-reel packaging for SMT production lines
Integrated diplexers and power management
Stable WiFi-Bluetooth coexistence
Reduces PCB layout complexity and design-in time
Target Applications
️ Ultra-Thin Laptops & 2-in-1 Tablets
Slim chassis design enabled by the 1.7mm profile, with high-speed WiFi 6 for 4K streaming and large file transfers, and stable Bluetooth for stylus, keyboard, and audio peripherals.
Slim Smart TVs & Digital Signage
Compact layout for narrow-bezel displays, with dual-band WiFi for 4K/8K media streaming and Bluetooth for remote controls, soundbars, and audio devices.
Mini PCs, Set-Top Boxes & Embedded Computers
Low-profile module fits mini enclosures, delivering high throughput for cloud services and media applications, with reliable RF performance in metal casings.
Portable Industrial Terminals & HMIs
Wide temperature range for industrial environments, vibration-resistant soldered assembly, WiFi 6 for real-time data uplink, and Bluetooth 5.2 for scanners, sensors, and peripherals.
Smart Home & IoT Edge Devices
Miniature size for compact smart home hardware, optimized for always-on connected devices with stable 2.4G/5G roaming and sensor connectivity.
Solution Specifications
Parameter
Detail
Module Model
BL-M8852BP6
Chipset
Realtek RTL8852BE-CG
WiFi Standard
802.11a/b/g/n/ac/ax (WiFi 6)
Bluetooth
5.2 Dual-Mode (LE + BR/EDR)
Form Factor
M.2 1216-S4 Soldered
Dimensions
16.0 × 12.0 × 1.7 mm
Interface
PCIe 1.1 (WLAN) + USB 2.0 FS (BT)
Antenna
2× MHF4 / IPEX4
Operation Temp
-20℃ to +70℃
Power
3.3V ±0.2V
Why Choose This Solution
Enables ultra-slim product designs without sacrificing wireless performance
Eliminates socket-related reliability issues with soldered construction
Reduces BOM and assembly costs for high-volume production
Delivers stable WiFi 6 + Bluetooth 5.2 connectivity in a single compact module
Supported by LB-LINK’s engineering team for design-in, layout, and driver integration
Guangming District, Shenzhen, as a research and development and market service base, and equipped with more than 10,000m² automated production workshops and logistics warehousing centers.
