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BL-M6256AS3
LB-LINK
Without BT
iComm-semmi
1T1R
SDIO Interface
Wi-Fi 4 (802.11n)
High Power 5G Wi-Fi Module with 5.8G Frequency and Arduino Compatibility
Introduction
BL-M6256AS3 is a highly integrated dual-band WLAN module base on SV6256P, which combines SDIO Interface, MCU, SRAM, PMU, and 1T1R WLAN MAC/BB/Radio in single chip. It compatible IEEE 802.11 a/b/g/n standard and provides the maximum PHY rate up to 150Mbps. The module provides low-power, highest throughput and superior RF performance for embedded system, such as IP cameras, POS, OTT Box.
Features
Operating Frequencies: 2.4~2.4835GHz or 5.15~5.85GHz
Support 802.11 a/b/g/n
Support AP/STA mode
SDIO 1.1/2.0 device interface
DC3.3V single power supply
Block Diagram
General Specifications
Module Name | BL-M6256AS3 150Mbps WLAN SDIO Module |
Chipset | SV6256P |
WLAN Standards | IEEE802.11a/b/g/n |
Host Interface | SDIO 1.1/2.0 |
Antenna | |
Dimension | 13.5*13.0*2.1mm (L*W*H) |
Power Supply | DC 3.3V±0.2V @500 mA (Max) |
Operation Temperature | -20℃ to +70℃ |
Operation Humidity | 10% to 95% RH (Non-Condensing) |
Product Dimension
Module dimension: 13.5*13.0*2.1mm (L*W*H; Tolerance: ±0.15mm)
IPEX / MHF-1 connector dimension: 2.6*3.0*1.2mm (L*W*H, Ø2.0mm)
Package Dimensions
Package specification:
1,000 modules per roll and 5,000 modules per box.
Outer box size: 37.5*36*29cm.
The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm (with a width of 24mm carrying belt).
Put 1 package of dry agent (20g) and 1 humidity card in each anti-static vacuum bag.
Each carton is packed with 5 boxes.
High Power 5G Wi-Fi Module with 5.8G Frequency and Arduino Compatibility
Introduction
BL-M6256AS3 is a highly integrated dual-band WLAN module base on SV6256P, which combines SDIO Interface, MCU, SRAM, PMU, and 1T1R WLAN MAC/BB/Radio in single chip. It compatible IEEE 802.11 a/b/g/n standard and provides the maximum PHY rate up to 150Mbps. The module provides low-power, highest throughput and superior RF performance for embedded system, such as IP cameras, POS, OTT Box.
Features
Operating Frequencies: 2.4~2.4835GHz or 5.15~5.85GHz
Support 802.11 a/b/g/n
Support AP/STA mode
SDIO 1.1/2.0 device interface
DC3.3V single power supply
Block Diagram
General Specifications
Module Name | BL-M6256AS3 150Mbps WLAN SDIO Module |
Chipset | SV6256P |
WLAN Standards | IEEE802.11a/b/g/n |
Host Interface | SDIO 1.1/2.0 |
Antenna | |
Dimension | 13.5*13.0*2.1mm (L*W*H) |
Power Supply | DC 3.3V±0.2V @500 mA (Max) |
Operation Temperature | -20℃ to +70℃ |
Operation Humidity | 10% to 95% RH (Non-Condensing) |
Product Dimension
Module dimension: 13.5*13.0*2.1mm (L*W*H; Tolerance: ±0.15mm)
IPEX / MHF-1 connector dimension: 2.6*3.0*1.2mm (L*W*H, Ø2.0mm)
Package Dimensions
Package specification:
1,000 modules per roll and 5,000 modules per box.
Outer box size: 37.5*36*29cm.
The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm (with a width of 24mm carrying belt).
Put 1 package of dry agent (20g) and 1 humidity card in each anti-static vacuum bag.
Each carton is packed with 5 boxes.
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