Introductio
BL-M8723DS1 valde integrata est IEEE802.11b/g/n WLAN et Bluetooth 2.1/4.2 combo basi moduli in RTL8723DS chip, quod componit MCU cum SDIO et HS-UART interfacies, a WLAN MAC, a 1T1R capax WLAN basebandi, BT Protocollum Stacko, BT WLAN/ RF in unum. Modulus plenam solutionem praebet magno throughput perficiendi WLAN et Bluetooth integrae.
Features
Frequentia operans: 2.4~2.4835GHz
IEEE Signa: IEEE 802.11b/g/n
Wireless PHY rate potest pervenire ad 150Mbps
Fulcit Bluetooth v2.1+EDR/v4.2
Antenna externa per medium foramen codex coniungere
Potestas Supple: 3.3V potestas principalis et 1.8V/3.3VI/O potestas
Obstructionum Diagram
![2]()
Specificationes generales
OMNIBUS Nomen |
BL-M8723DS1 |
Chipset |
RTL8723DS-CG |
WLAN Signa |
IEEE802.11b/g/n |
BT Signa |
Bluetooth Core Specification v4.2/2.1 |
Hospes Interface |
SDIO pro WLAN & UART ad Bluetooth |
Antenna |
Antennae externae per medium foramen caudex coniungere |
Dimension |
12*12*1.6mm (L*W*H) |
Potestas Supple |
DC 3.3V±0.2V @ 450 mA ( Max) principalis potentia DC 3.3V±0.2V vel 1.8V±0.1VI/O power |
Operatio Temperature |
-20℃ ad +70℃ |
operatio Umor |
X% ad XCV% RH (Non-Condensing) |
Product Dimension
![3]()
Module dimensio: 12.0*12.0*1.6mm (L*W*H; Tolerantia: ±0.15mm)
Sarcina Dimensiones
![4]()
![5]()
Specificatio sarcina:
1. 2.000 modulorum per volumen et 10,000 modulorum per capsam.
2. Arca exterioris magnitudinis: 37.5*36*29cm.
3. Diameter caerulei ambitus amicae Flexilis laminae est 13 digitorum, cum tota crassitudine 28mm
(cum latitudine 24mm balteum gerens).
4. Pone 1 sarcinam agentis aridae (20g) et humiditatis chartae in singulis sacculi anti-staticis vacuo.
5. Quisque lobortis cum 5 scriniis refertum est.
