Introductio
BL-M8723DS1 is a highly integrated IEEE802.11b/g/n WLAN and Bluetooth 2.1/4.2 combo module base on RTL8723DS chip, which combines MCU with SDIO and HS-UART interface, a WLAN MAC, a 1T1R capable WLAN baseband, BT Protocol Stack, BT Baseband, modem, and WLAN/BT RF in a una chip. Modulus providet completum solutio ad altum throughput perficientur integrated WLAN et Bluetooth.
Features
Operating Frequencies: 2.4 ~ 2.4835GHz
IEEE Signa: IEEE 802.11B / G / N
Wireless Phy rate potest pervenire ad 150mbps
Supports Bluetooth v2.1 + Edr / v4.2
Iungo ad externum antenna per medium foraminis codex
Vox Supple: 3.3v Power et 1.8V / 3.3vi / O Power
Obstructionum Diagram
Generalis specifications
OMNIBUS | BL-m8723ds1 |
Chipset | RTL8723Ds, CG |
WLAN signa | Iee82.11b / g / n |
BT signa | Bluetooth Core Specification V4.2 / 2.1 |
HOST Interface | SDIO ad WLAN & UART ad Bluetooth |
Antenna | Iungo ad externum Antenas per medium foraminis codex |
Dimensio | XII * XII * 1.6mm (L * w * h) |
POPULUM | DC 3.3v ± 0.2V @ CDL MA ( Max) Main Power DC 3.3v ± 0.2V aut 1.8v ± 0.1vi / O potentia |
Operatio temperatus | -20 ℃ ad + LXX ℃ |
Operatio Umor | X% ad XCV% RH (non-condensing) |
Productum dimensionem
Module dimensionem: 12.0 * 12.0 * 1.6mm (L * w * h; tolerantia, ± 0.15MM)
Sarcina dimensiones
Package Specification:
I. 2,000 modulorum per roll et 10,000 modulorum per arca.
II. Puteus Size: 37,5 * * 29cm 37.5.
III. Diametrum hyacintho amet-amica Flexilis laminam est XIII pollices, cum totalis crassitudine 28mm
(Cum latitudinem 24mm laterum).
IV. Posuit I sarcina ex arida agente (20g) et humiditas card in se anti-stabilis vacuo peram.
V. Quisque lobortis est cum V boxes.
