M8723DS1 1T1R 802.11b/g/n WiFi+B Module

Introduction

BL-M8723DS1 is a highly integrated IEEE802.11b/g/n WLAN and Bluetooth 2.1/4.2 combo module base on RTL8723DS chip, which combines MCU with SDIO and HS-UART interface, a WLAN MAC, a 1T1R capable WLAN baseband, BT Protocol Stack, BT Baseband, modem, and WLAN/BT RF in a single chip. The module provides a complete solution for a high throughput performance integrated WLAN and Bluetooth.

Features

Operating Frequencies: 2.4~2.4835GHz

IEEE Standards: IEEE 802.11b/g/n

Wireless PHY rate can reach up to 150Mbps

Supports Bluetooth v2.1+EDR/v4.2

Connect to external antenna through half hole pad

Power Supply: 3.3V main power and 1.8V/3.3V I/O power

Block Diagram

General Specifications

Module Name	BL-M8723DS1
Chipset	RTL8723DS-CG
WLAN Standards	IEEE802.11b/g/n
BT Standards	Bluetooth Core Specification v4.2/2.1
Host Interface	SDIO for WLAN & UART for Bluetooth
Antenna	Connect to the external   antenna through half hole pad
Dimension	12*12*1.6mm (L*W*H)
Power Supply	DC 3.3V±0.2V @ 450 mA (Max)   main power DC 3.3V±0.2V or   1.8V±0.1V I/O power
Operation Temperature	-20℃ to +70℃
Operation Humidity	10% to 95% RH   (Non-Condensing)

Product Dimension

Module dimension: 12.0*12.0*1.6mm (L*W*H; Tolerance: ±0.15mm)

Package Dimensions

Package specification:

1. 2,000 modules per roll and 10,000 modules per box.

2. Outer box size: 37.5*36*29cm.

3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm 

    (with a width of 24mm carrying belt).

4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag.

5. Each carton is packed with 5 boxes.