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M8723DS1 1T1R 802.11b/g/n WiFi+B Module

  • RTL8723DS-CG
  • SDIO UART
  • 2.4GHz
  • 150Mbps
  • 1x1 1T1R
  • 12*12*1.6mm
Availability:
Quantity:
  • BL-M8723DS1

  • LB-LINK

  • Without BT  V4.2 

  • REALTEK 

  • 1T1R 

  • Wi-Fi:SDIO BT:UART 

  • Wi-Fi 4 (802.11n) 

Introduction

BL-M8723DS1 is a highly integrated IEEE802.11b/g/n WLAN and Bluetooth 2.1/4.2 combo module base on RTL8723DS chip, which combines MCU with SDIO and HS-UART interface, a WLAN MAC, a 1T1R capable WLAN baseband, BT Protocol Stack, BT Baseband, modem, and WLAN/BT RF in a single chip. The module provides a complete solution for a high throughput performance integrated WLAN and Bluetooth.



Features

Operating Frequencies: 2.4~2.4835GHz

IEEE Standards: IEEE 802.11b/g/n

Wireless PHY rate can reach up to 150Mbps

Supports Bluetooth v2.1+EDR/v4.2

Connect to external antenna through half hole pad

Power Supply: 3.3V main power and 1.8V/3.3V I/O power




Block Diagram


图片2


General Specifications


Module Name

BL-M8723DS1

Chipset

RTL8723DS-CG

WLAN Standards

IEEE802.11b/g/n

BT Standards

Bluetooth Core Specification v4.2/2.1

Host Interface

SDIO for WLAN & UART for Bluetooth

Antenna

Connect to the external   antenna through half hole pad

Dimension

12*12*1.6mm (L*W*H)

Power Supply

DC 3.3V±0.2V @ 450 mA (Max)   main power

DC 3.3V±0.2V or   1.8V±0.1V I/O power

Operation Temperature

-20℃ to +70℃

Operation Humidity

10% to 95% RH   (Non-Condensing)



Product Dimension

图片3

Module dimension: 12.0*12.0*1.6mm (L*W*H; Tolerance: ±0.15mm)



Package Dimensions

图片4

图片5

Package specification:

1. 2,000 modules per roll and 10,000 modules per box.

2. Outer box size: 37.5*36*29cm.

3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm 

    (with a width of 24mm carrying belt).

4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag.

5. Each carton is packed with 5 boxes.

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